The Advanced Smart Manufacturing Technology Alliance of National Chung Hsing University will host the '2026 Forum on High-Bandwidth Interconnects in the AI Era: Design, Testing, and Mass Production of Advanced Packaging × Silicon Photonics.' The forum will feature Professor Jing-Wei Pei from the university’s Institute of Photonics, along with several industry experts as speakers. Through the valuable experiences shared by the speakers, the event aims to help participants gain insights into silicon photonics applications, mass production testing, and the industrial development of advanced semiconductor packaging.
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