As AI and robotics are rapidly being deployed on the manufacturing floor, how manufacturers in Central Taiwan can integrate existing industrial strengths and expand international cooperation opportunities will be critical to future development.
This event focuses on the development directions of AI robotics in precision machinery and manufacturing applications. Through exchanges between research institutes and industry leaders, the forum aims to help industry players stay abreast of emerging trends and foster collaborative partnerships.
The Advanced Smart Manufacturing Technology Alliance of National Chung Hsing University will host the '2026 Forum on High-Bandwidth Interconnects in the AI Era: Design, Testing, and Mass Production of Advanced Packaging × Silicon Photonics.' The forum will feature Professor Jing-Wei Pei from the university’s Institute of Photonics, along with several industry experts as speakers. Through the valuable experiences shared by the speakers, the event aims to help participants gain insights into silicon photonics applications, mass production testing, and the industrial development of advanced semiconductor packaging.
ma@tmba.org.tw