High-Bandwidth Interconnects in the AI Era: Design, Verification, and Manufacturing of Advanced Packaging and Silicon Photonics

2026 / 01 / 15

Course Information

Course Name	Course Schedule	Location	Course Duration	Organizing Unit	Contact Person
High-Bandwidth Interconnects in the AI Era: Design, Verification, and Manufacturing of Advanced Packaging and Silicon Photonics	~	National Chung Hsing University	8 HRs	National Chung Hsing University

Registration Information

High-Bandwidth Interconnects in the AI Era: Design, Verification, and Manufacturing of Advanced Packaging and Silicon Photonics

Class Time：2026 / 01 / 15 ~ 2026 / 01 / 15
Location：National Chung Hsing University
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