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| Course Name | Class Time | Location | Organizer |
|---|---|---|---|
| Course Name High-Bandwidth Interconnects in the AI Era: Design, Verification, and Manufacturing of Advanced Packaging and Silicon Photonics | Class Time2026 / 01 / 15 ~ 2026 / 01 / 15 | LocationNational Chung Hsing University | OrganizerNational Chung Hsing University (8 HRs) |
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