Compound semiconductors such as silicon carbide (SiC) and gallium nitride (GaN) offer superior stability under high temperature, pressure, and current, making them essential for electric vehicles, 5G, and other high-power applications. SiC processing is challenging, requiring cutting, grinding, and polishing steps. Global leaders like Disco, Tokyo Seimitsu, and Applied Materials dominate key technologies. As demand grows, machine tool manufacturers can seize opportunities by upgrading cutting, grinding, and polishing capabilities and securing wafer fab validation to enter the semiconductor equipment market.