Driving the AI Era! TMBA SMART TEAM Shines at SEMICON Taiwan 2025 Taiwan’s Role as a Global Semiconductor Innovation Hub Reaffirmed
SEMICON Taiwan 2025: A Global Semiconductor Celebration
The world’s premier semiconductor event, SEMICON Taiwan 2025, concluded successfully on September 12. Marking its 30th anniversary, the exhibition was elevated to the status of an International Semiconductor Week under the theme “Together for Innovation.” Over three days, the show attracted more than 100,000 visitors, featured 1,200 companies from 65 countries, and hosted 4,100 booths, underscoring Taiwan’s pivotal role in the global semiconductor supply chain.
The exhibition spotlighted advanced process and packaging technologies, extending into AI, automotive electronics, and sustainability. Packaging, green manufacturing, and materials zones ranked among the fastest‑growing segments in recent years. More than 200 global industry leaders gathered to announce milestones, including the launch of the 3DIC Advanced Packaging Manufacturing Alliance and the adoption of the SEMI E187 cybersecurity verification standard—signaling Taiwan’s transformation from a manufacturing stronghold to an innovation hub.
TMBA SMART TEAM Showcases Precision Manufacturing Strength
The TMBA SMART TEAM, led by the Taiwan Machine Tool & Components Association (TMBA), drew strong crowds from September 10–12. Together with ten member companies, TMBA highlighted the indispensable role of machine tools and components in the semiconductor supply chain.
The showcase focused on three pillars:
- Digital Transformation: Awea presented high‑rigidity gantry machining centers; Buffalo transferred aerospace technology to semiconductor equipment; Chiah Chyun introduced a mill‑turn machining center.
- Green Transformation: FFG displayed smart grinding machines; Pusen unveiled oil‑free hydrostatic spindles; Winston provided high‑precision temperature control systems.
- Localized Solutions: Jianhe specialized in grinding ingots, wafers, and carriers; Pufa developed ultra‑precision 1μm grinders; Tenber offered smart factory integration; Dayungcheng provided structural solutions for semiconductor equipment.
These innovations received strong recognition, with positive feedback from visitors serving as a powerful motivation for TMBA and its members to continue advancing.
Securing a Prime Position for 2026
SEMICON Taiwan 2026 will be held from September 2–4. TMBA has secured booth Q5352 on the first floor of Hall 2, Nangang Exhibition Center, strategically located near the main passageway between Halls 1 and 2. This premium location offers excellent visitor flow and visibility, making it an ideal platform to showcase technical capabilities and attract international buyers.
TMBA warmly invites machine tool and component companies still considering participation to seize this opportunity. By joining forces, exhibitors can leverage this advantageous position to enhance brand visibility and demonstrate Taiwan’s leadership in precision manufacturing on the global semiconductor stage. Together, we look forward to achieving new milestones in 2026.
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