The rapid expansion of AI applications, together with continued growth in advanced process technologies, memory, testing, and advanced packaging, is driving investment in semiconductor equipment and raising requirements for precision, stability, cleanliness, and reliability. For the third consecutive year, the Taiwan Machine Tool & Accessory Builders’ Association (TMBA) organized a delegation to SEMICON Taiwan and established the TMBA SMART TEAM pavilion. Under the theme “Precision Manufacturing—Supporting Every Chip,” the pavilion showcased the manufacturing expertise that Taiwan’s machine tool and component industries have built over decades and demonstrated its value to the high-value-added semiconductor equipment supply chain.

SEMICON Taiwan reached a record scale this year, attracting more than 1,300 exhibitors across 4,300 booths and over 130,000 industry professionals from 65 countries and regions. As the global semiconductor supply chain undergoes restructuring and demand for equipment localization continues to grow, TMBA used its collective brand platform to integrate expertise in precision machining, critical components, thermal management, materials grinding, surface finishing, and certification services. This enabled member companies to engage equipment manufacturers, wafer fabs, and engineering teams with more comprehensive solutions.

The SMART TEAM Pavilion Showcases Diverse Manufacturing Solutions Across a Single Ecosystem

The TMBA SMART TEAM pavilion featured nine participants: eight member companies—WINSON, USYNC, LV INTERNATIONAL, HARTFORD, WEXTEN, PERFECT MACHINE, POSA, and JAINNHER—together with the Precision Machinery Research & Development Center (PMC). Built around the curatorial concept of a “Manufacturing Solutions Collective,” the pavilion covered machine structures, core drive systems, hard and brittle material machining, grinding, and precision surface finishing, as well as equipment safety design and international certification. Together, these capabilities demonstrated the cross-disciplinary solutions required across the semiconductor equipment value chain, from manufacturing through compliance.

During the exhibition, TMBA arranged daily themed tours and technical presentations by participating companies, supported by on-site networking, short-form social media videos, and online business matching through MTB2B. This integrated approach enabled equipment buyers to quickly identify the capabilities of Taiwanese suppliers. The value of the group pavilion extended beyond collective visibility: it helped translate semiconductor market requirements—including precision, vibration control, thermal stability, cleanliness, delivery schedules, and certification—into concrete priorities for members’ R&D upgrades and cross-sector collaboration.

From Machining Suppliers to Equipment Manufacturing Partners

TMBA Chairman Chen Shen-Teng noted that the AI wave is reshaping the competitive landscape of semiconductor equipment manufacturing. Stable volume production of advanced chips depends not only on wafer fabrication processes and chip design, but also on a precise, stable, clean, and reliable equipment manufacturing ecosystem. The deep expertise of Taiwan’s machine tool and component industries in precision machining, machine structures, and automation integration provides essential support for the semiconductor industry’s continued advancement.

For machine tool companies, entering the semiconductor equipment supply chain requires more than adapting existing products. Suppliers must address customer requirements in the “language of the semiconductor industry” by incorporating material characteristics, cleanroom standards, thermal and vibration control, equipment safety, and international certification from the earliest stages of design. Through the TMBA SMART TEAM pavilion, TMBA created a cross-sector platform that enables members to start by solving process challenges and progressively evolve from individual machining or component suppliers into long-term partners capable of jointly developing, validating, and mass-producing solutions with equipment manufacturers.

Looking ahead to 2027, TMBA SMART TEAM will expand its presence at Booth P5312 on the first floor of Taipei Nangang Exhibition Center, Hall 2. Continuing under the theme “Precision Manufacturing—Supporting Every Chip” and building on the Manufacturing Solutions concept, the pavilion will bring together more member companies with capabilities relevant to semiconductor applications. It will present a diverse portfolio spanning precision structural components, critical components, materials processing, thermal management, precision surface finishing, smart manufacturing, and international certification, further strengthening the visibility and involvement of Taiwan’s machine tool industry in the global semiconductor equipment supply chain.

TMBA SMART TEAM Exhibitor Highlights