Driven by AI and high-performance computing, the semiconductor industry is shifting from process miniaturization toward system-level integration and advanced packaging, placing new pressure on equipment capacity, lead times, and local supply chain resilience. Held during SEMICON Taiwan 2026, the Semiconductor Supply Chain Resilience Forum created a platform for two-way collaboration between semiconductor players and Taiwan’s precision machinery sector. Discussions highlighted co-development, quality traceability, packaging and testing applications, and industrial capability mapping, underscoring how Taiwan’s machine tool and component makers can move from specialized suppliers to valuable manufacturing partners in the semiconductor equipment ecosystem.